{"id":989,"date":"2018-10-15T12:42:20","date_gmt":"2018-10-15T19:42:20","guid":{"rendered":"https:\/\/www.crystalfontz.com\/blog\/?post_type=encyclopedia&#038;p=989"},"modified":"2018-10-15T13:07:32","modified_gmt":"2018-10-15T20:07:32","slug":"bga","status":"publish","type":"encyclopedia","link":"https:\/\/www.crystalfontz.com\/blog\/glossary\/bga\/","title":{"rendered":"BGA"},"content":{"rendered":"<p>BGA stands for Ball Grid Array.<\/p>\n<p>A type of high-density electronic component package for integrated circuits.<\/p>\n<p>The BGA has solder balls on its backside, which line up with corresponding contacts on the front side of the PCB. The part and PCB are heated until the solder balls melt.<\/p>\n<p>The surface tension of the molten solder makes the chip &ldquo;float&rdquo; on the board, which also aligns it perfectly with the pads on the PCB.<\/p>\n<figure id=\"attachment_993\" aria-describedby=\"caption-attachment-993\" style=\"width: 700px\" class=\"wp-caption aligncenter\"><img loading=\"lazy\" decoding=\"async\" class=\"wp-image-993 size-large\" src=\"https:\/\/www.crystalfontz.com\/blog\/wp-content\/uploads\/9-pin_BGA-0-700x561.jpg\" alt=\"Crystalfontz 9-pin BGA\" width=\"700\" height=\"561\" srcset=\"https:\/\/www.crystalfontz.com\/blog\/wp-content\/uploads\/9-pin_BGA-0-700x561.jpg 700w, https:\/\/www.crystalfontz.com\/blog\/wp-content\/uploads\/9-pin_BGA-0-250x201.jpg 250w, https:\/\/www.crystalfontz.com\/blog\/wp-content\/uploads\/9-pin_BGA-0-768x616.jpg 768w, https:\/\/www.crystalfontz.com\/blog\/wp-content\/uploads\/9-pin_BGA-0-120x96.jpg 120w, https:\/\/www.crystalfontz.com\/blog\/wp-content\/uploads\/9-pin_BGA-0.jpg 800w\" sizes=\"auto, (max-width: 700px) 100vw, 700px\"><figcaption id=\"caption-attachment-993\" class=\"wp-caption-text\">Crystalfontz 9-pin BGA, shown on a US penny for reference. Penny diameter:&nbsp;19.05 mm (0.75 in).<\/figcaption><\/figure>\n","protected":false},"excerpt":{"rendered":"<p>BGA stands for Ball Grid Array. A type of high-density electronic component package for integrated circuits. The BGA has solder balls on its backside, which line up with corresponding contacts on the front side of the PCB. The part and PCB are heated until the solder balls melt. The surface tension of the molten solder [&hellip;]<\/p>\n","protected":false},"author":6,"featured_media":0,"template":"","meta":{"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"","adv-header-id-meta":"","stick-header-meta":"","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"default","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"ast-content-background-meta":{"desktop":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}}},"class_list":["post-989","encyclopedia","type-encyclopedia","status-publish","hentry"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.3 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>BGA - Crystalfontz LCD Glossary<\/title>\n<meta name=\"description\" content=\"BGA : BGA stands for Ball Grid Array. A type of high-density electronic component package for integrated circuits. The BGA has solder balls on its backside,\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.crystalfontz.com\/blog\/glossary\/bga\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"BGA - Crystalfontz LCD Glossary\" \/>\n<meta property=\"og:description\" content=\"BGA : BGA stands for Ball Grid Array. A type of high-density electronic component package for integrated circuits. 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